GHz BGA Sockets-0.8mm; IC Size X (mm): 19; IC Size Y (mm): 19; IC Array X: 22; IC Array Y: 22; Max Pincount: 484; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.6; IC Ball Height Max (mm): 0.4; IC Ball Height Min (mm): 0.2; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: flat; Socket Lid: swivel; Part Description: GHz BGA Socket (ZIF)
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