DSA00345479.pdf

Manufacturer Sharp
Partial File Text The Dawn of 3D Packaging as System-in-Package (SIP) Morihiro Kada Abstract The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

DSA00345479.pdf preview Download Datasheet