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    DSA0062300.pdf

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    • PDF: 2001 Feb 13 Philips Semiconductors Package outline HBGA1312: plastic, heatsink ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm A B D SOT624-1 ball A1 index area
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    DSA0062300.pdf preview Download Datasheet

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