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DSA00312318.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPS041 Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 41 x 41 MILS Die Thickness 8.7 MILS ± 0.6 MILS
Type
Original
ECAD Model
Part Details
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DSA00312318.pdf preview
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BRX49
BRX49 datasheet
BRX49 SCR
CPS041
CS18D
CS89M
CS92D
SCR BRX49
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