DSA0079862.pdf

Manufacturer Aeroflex
Partial File Text Standard Products RadHard Eclipse FPGA Advanced Data Sheet September, 2004 www.aeroflex.com/RadHardFPGA FEATURES 0.25µm, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

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