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    DSAZSAA00020486.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XQFN8 package SOT902-2 Hx D (8×) 0.025 0.025 C (7×) Hy Ay 1.000 SLy 0.110 0.320 SLx 1.200
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    DSAZSAA00020486.pdf preview Download Datasheet

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