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DSA00298192.pdf
Manufacturer
Philips Semiconductors
Partial File Text
PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
HTSSOP-20
HTSSOP20