Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00135408.pdf

    • -
    • PROCESS CP361R Small Signal MOSFET N-Channel Enhancement-Mode MOSFET Chip PROCESS DETAILS Die Size 14.2 x 14.2 MILS Die Thickness 3.9 MILS Gate Bonding Pad Area 3.94 x 3.94
    • Original

    DSASW00135408.pdf preview Download Datasheet

    User Tagged Keywords

    CEDM7001 CMNDM7001
    Price & Stock Powered by Findchips
    Supplyframe Tracking Pixel