DSASL00103902.pdf

Manufacturer NXP Semiconductors
Partial File Text At a glance IP425xCZ8-4/CZ12-6/CZ16-8 Package Ultra Thin Leadless Package (UTLP) - HXSON12: plastic thermal enhanced extremely thin small outline package; 12 terminals; body 1.35 x 2.5 x 0.5 mm
Datasheet Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

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