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    DSASW0034174.pdf

    • Linear Technology
    • MSE Package 10-Lead Plastic eMSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev F) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 ± 0.102 (.074 ± .004) 5.23 (.206) MIN 0.889 ± 0.127 (.
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