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    DSAISS0006713.pdf

    • Central Semiconductor
    • PROCESS CPS057 Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 57 x 57 MILS Die Thickness 8.7 MILS ± 0.6 MILS
    • Original
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    DSAISS0006713.pdf preview Download Datasheet

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