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    DSAZIHA100084778.pdf

    • Central Semiconductor
    • PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size 11 x 11 MILS Die Thickness 3.94 MILS Cathode Bonding Pad Areas (4) 3.54 MILS DIAMETE
    • Original
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