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DSAFRAZ0015624.pdf
Manufacturer
National Semiconductor
Partial File Text
Packaging/CSP Wireless: Product Overview Page 1 August 1998 Substrate CSP Top View · 68% Board Area Reduction (vs. TSSOP 20) Only 25% larger than die · Standard SMT Process · JEDE
Datasheet Type
Original
ECAD Model
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CSP28
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TSSOP 16l Package
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