The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAE0028260.pdf
Manufacturer
Freescale Semiconductor
Partial File Text
Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array (LGA) Style Packages 1 Introduction This appl
Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSAE0028260.pdf preview
Download Datasheet
User Tagged Keywords
AN1902
AN3281
AN3311
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
fr-5 laminate
Lead Free reflow soldering profile BGA
LGA PACKAGE thermal resistance Freescale
LGA voiding
reflow profile FOR LGA COMPONENTS
Price & Stock Powered by
Findchips