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    DSA2IH0067691.pdf

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    • HSXAWAVS Hexawave, Inc. Power FET Chip Handling Instruction Die Bonding Procedure Equipments and Tools 1. Die Bonder 2. Tweezers (Type SS) 3. Thermometer Procedure I. Perform all steps in a
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    7416a chip bonding die DIE BONDER
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