Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00296620.pdf

    • -
    • Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies T. T. Mattila, R. J. James, L. Nguyen* and J. K. Kivilahti Laboratory of Electronic Productio
    • Original

    DSASW00296620.pdf preview Download Datasheet

    User Tagged Keywords

    6335F JEOL 6335F JESD22-B111 JESD22-b111 drop JESD22B111 multicore solder paste PXI-6052E
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel