DSAZSAA00020271.pdf
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NXP Semiconductors
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Reflow soldering footprint
Footprint information for reflow soldering of HXQFN60 package
SOT1134-2
4.25
0.5
0.3
0.3
3.9 2.55
0.35
5.2 5.8 6.25
1.1
0.45
1.1
1.9
solder
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Original
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Part pricing, stock, data attributes from Findchips.com