DSAZSAA00020102.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline WLCSP6: wafer level chip-size package; 6 bumps (2 x 3) D bump A1 index area A2 E A A1 detail X e b C e e1 B A European projection 1 2 X wlcs
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00020102.pdf preview Download Datasheet