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DSAZSAA00019904.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1
Type
Original
ECAD Model
Part Details
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