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    DSAZSAA00019064.pdf

    • NXP Semiconductors
    • Package outline LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm SOT536-1 A B D ball A1 index area A E A2 A1 detail X e1
    • Original
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