Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DASF0046650.pdf

    • -
    • Application Note AN9046 Assembly Guidelines for Dual Power56 Packaging By Dennis Lang INTRODUCTION The Fairchild® Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. T
    • Original

    DASF0046650.pdf preview Download Datasheet

    User Tagged Keywords

    7525a 7525A smt AN9046 entek ht plus FDMS9600S Intel reflow soldering profile BGA ipc 610D ipc 7525A IPC-4101 IPC-4101B IPC-7525 IPC-A-610 IPC-A-610-D IPC-SM-7525A IPC7525 J-STD-001 J-STD-001C Lead Free reflow soldering profile BGA POWER56 voids

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel