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    DSAZSAA00019979.pdf

    • NXP Semiconductors
    • Package outline VFBGA353S: plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm D e4 ball/land A1 index area 1 2 3 4
    • Original
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    DSAZSAA00019979.pdf preview Download Datasheet

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