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    DSAZSAA00018979.pdf

    • NXP Semiconductors
    • Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391A D A F 3 D1 U1 B q c C 1 H p U2 A 2 E1 E w1 M A M B M w2 M C M b
    • Original
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    DSAZSAA00018979.pdf preview Download Datasheet

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