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    DSADA0023350.pdf

    • Philips Semiconductors
    • PDF: 2003 Nov 21 Philips Semiconductors Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball
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    DSADA0023350.pdf preview Download Datasheet

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