DSA00522209.pdf

Manufacturer Ohmite
Partial File Text FEATURES · Superior thermal expansion cycling · Inductance less than 10 nanohenries · Flameproof · Solderable pads: Tin (Sn) plate · Lead flexible for thermal expansion · Low termination stress ("J"
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSA00522209.pdf preview Download Datasheet