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DSAZSAA00019628.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad SOT1331-1 E A D X c y expos
Type
Original
ECAD Model
Part Details
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