ScansUX9100.pdf

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Partial File Text > BOTTOM VIFW TOP VI FW PACKAGE OUTLINE SIGNATURE QA APVD : DATE jfe Dallas Semiconductor ENGR MGR: - DS75X FLIP CHIP PACKAGE CHECK BY: DRAWN BY: SIZE A FSCM NO, SCALE NDNE DWG NO. DS75X SHEET REV A 0
Datasheet Type Scan
ECAD Model

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