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    DSAZSAA00020001.pdf

    • NXP Semiconductors
    • Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm SOT909-1 0 1 2 mm scale X B D A A E A1
    • Original
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    DSAZSAA00020001.pdf preview Download Datasheet

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