Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAASSA0009270.pdf

    • Philips Semiconductors
    • Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations Jeroen Bielen, Jan-Joris Gommans, Frank Theunis Philips Semi
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAASSA0009270.pdf preview Download Datasheet

    User Tagged Keywords

    Coffin-Manson Equation copper bond wire igbt thermal characterization and simulation using ansys s-n curve
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel