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DSASW00343901.pdf
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Partial File Text
USER'S MANUAL (Chip Scale Package) ยท To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package's characteristics and manuals to maintai
Type
Original
ECAD Model
DSASW00343901.pdf preview
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User Tagged Keywords
1mm pitch BGA socket
air handling unit
CRACK
FBGA 8 x 14 package tray
fbga Substrate design guidelines
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HCFC141B
LGA socket
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Samsung MCP
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