DSAIHSC0008736.pdf

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Partial File Text MATERIAL INSULATOR; GLASS-REN FORCED THERMOPLASTIC, 65.79+ 0.30 1 4.&g 78 CONTACT: COPPER ALLOY. PLATNG: MATING AREA - SELECTED GLOD OVER NCKEL SOLDER AREA - UN/LEAD OVER NICKEL. 44.
Type Scan
ECAD Model

DSAIHSC0008736.pdf preview Download Datasheet