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    DSAZSAA00019986.pdf

    • NXP Semiconductors
    • Package outline HTQFN48R: plastic thermal enhanced thin quad flat package; no leads; 48 terminals; resin based; body 7 × 7 × 1 mm B D SOT898-1 A terminal 1 index area A E de
    • Original
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    DSAZSAA00019986.pdf preview Download Datasheet

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