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DSAASSA0009124.pdf
Manufacturer
NXP Semiconductors
Partial File Text
NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's firs
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSAASSA0009124.pdf preview
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User Tagged Keywords
infocus
shear force
SOD882
SOD882D
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