DSAZSAA00018159.pdf
-
Amkor Technology
-
Data Sheet
LEADFRAME
ExposedPad
TSSOP/MSOP/SOIC/SSOP
Thermal Performance
Forced Convection, Single-layer PCB
Pkg
ExposedPad Thin Shrink Small
Outline Package (TSSOP), Micro
Small Outlin
-
Original
-
-
Part pricing, stock, data attributes from Findchips.com