DSAZSAA00018982.pdf
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NXP Semiconductors
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Package outline
HDIP18: plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
D
seating plane
ME
A2
A
A1
L
e
Z
b
10
18
c
w M
b1
(e 1)
b2
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Original
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