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DSAZSAA0006414.pdf
Manufacturer
Altera
Partial File Text
Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array (TCFCBGA) pac
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
KS-886H
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