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DSA0056735.pdf
Manufacturer
Philips Semiconductors
Partial File Text
PDF: 1999 Apr 16 Philips Semiconductors Package outline Hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads SOD91 G1 (2) b D L G L DIME
Type
Original
ECAD Model
Part Details
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marking G1
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