DSAZSAA00020260.pdf

Manufacturer NXP Semiconductors
Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00020260.pdf preview Download Datasheet