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DSA00299971.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPD41 Switching Diode High Current Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 8.0 MILS Anode Bonding Pad A
Datasheet Type
Original
ECAD Model
Part Details
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DSA00299971.pdf preview
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1N3600
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