DSAFRAZ0016336.pdf

Manufacturer Philips Semiconductors
Partial File Text PDF: 2002 Aug 08 Philips Semiconductors Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-3 c
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAFRAZ0016336.pdf preview Download Datasheet