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    DSAFRAZ0016335.pdf

    • Philips Semiconductors
    • PDF: 2002 Apr 24 Philips Semiconductors Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-2 c
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    DSAFRAZ0016335.pdf preview Download Datasheet

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    HLQFP144 MS-026

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