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DASF007783.pdf
Manufacturer
Texas Instruments
Partial File Text
Application Report SLOA122 July 2006 QFN Layout Guidelines Yang Boon Quek ........................................................................................ HPL Audio Power Amplifiers
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
dsp layout guidelines
QFN PACKAGE thermal resistance
SLOA122
SLUA271
TEXAS INSTRUMENTS, Mold Compound QFN