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DSAH00109876.pdf
Manufacturer
BH Electronics
Partial File Text
BH Electronics Bobbin Wound Surface Mount Designs A wide variety of packages and sizes are available starting with the .35 cm3 E-core design that uses less than 1 cm2 of board area. Parts as large
Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSAH00109876.pdf preview
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User Tagged Keywords
BH RM
ecore
EP 825
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