DSASW00306418.pdf

Manufacturer NXP Semiconductors
Partial File Text NXP SOD882D package with strong, visible side pads First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's first to offer s
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSASW00306418.pdf preview Download Datasheet