DSAZSAA00019910.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00019910.pdf preview Download Datasheet