Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00155467.pdf

    • -
    • New Products Hitachi Develops LFPAK Thin Power MOS FET Package Employing Bonding-Wire-Less Construction and Enabling 20% Reduction in On-Resistance < Typical Applications > ยท CPU power supplies i
    • Original

    DSA00155467.pdf preview Download Datasheet

    Price & Stock Powered by Findchips
    Supplyframe Tracking Pixel