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    DSAZIHA2X00060354.pdf

    • Micrel Semiconductor
    • Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is
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    DSAZIHA2X00060354.pdf preview Download Datasheet

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