DSADA0023167.pdf

Manufacturer Philips Semiconductors
Partial File Text PDF: 2003 Jan 29 Philips Semiconductors Package outline HBGA1312: plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink B D SOT624-1 A b
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

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