The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA00335796.pdf
Manufacturer
NXP Semiconductors
Partial File Text
AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 -- 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368,
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSA00335796.pdf preview
Download Datasheet
User Tagged Keywords
0.65mm pitch BGA
1mm pitch BGA
AN10778
BGA Ball Crack
fine BGA thermal profile
LFBGA32
LPC2220
LPC2292
LPC2364
LPC2368
LPC2458
LPC2468
LPC2468 pcb
LPC2468 reflow solder profile
LPC2470
LPC2478
LPC2478 pcb
LPC2880
LPC2888
lpc3154
lpc3250
MO-275
nxp cross
NXP LPC2368
SOT1018-1
sot930
sot950
SOT950-1
TFBGA208
TSOP 54 land pattern