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    DSAZSAA00020085.pdf

    • NXP Semiconductors
    • Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm A B D TFA9981UK bump A1 index area A2 E A A1 detail X e1 e ∅v ∅w b C
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